SHEAROGRAPHIC AND HOLOGRAPHIC ASSESSMENT OF DEFECTIVE LAMINATES WITH BOND-LINES OF DIFFERENT ELASTICITIES

被引:19
作者
SHANG, HM
THAM, LM
CHAU, FS
机构
[1] Department of Mechanical and Production Engineering, National University of Singapore, 0511
来源
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME | 1995年 / 117卷 / 03期
关键词
D O I
10.1115/1.2804546
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
While defects in laminated plates are readily revealed using double-exposure shearography and holography, when an incremental vacuum pressure is applied between the exposures, the apparent defect size, measured from the boundary of the perturbed fringes, may over-estimate the actual defect size depending on the elasticity of the bond-life. In this paper, the perturbed fringes were described by a mathematical model derived from the theory of thin plates supported by a Winkler type elastic foundation which takes into consideration the elasticity of the bond-line. Am iterative technique is subsequently presented for estimating the size and depth of the defect from the fringe pattern without the need to pre-determine the current elasticity of the bond-line. Laminates with a thick and highly elastic bond-line found in foam-adhesive bonded metal laminates, and those with a thin and brittle bond-line, found in multi-layered glassfibre reinforced plastic plates, were tested Results have shown that the defects in these laminates were accurately assessed.
引用
收藏
页码:322 / 329
页数:8
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