EFFECTS OF TEMPERATURE AND GRAIN-SIZE ON DEFORMATION AND FRACTURE IN RECRYSTALLIZED NI3AL DOPED WITH BORON

被引:13
作者
KIM, MS
HANADA, S
WATANABE, S
IZUMI, O
机构
[1] TOHOKU UNIV,INST MAT RES,SENDAI,MIYAGI 980,JAPAN
[2] TOHOKU UNIV,GRAD SCH,SENDAI,MIYAGI 980,JAPAN
关键词
D O I
10.1007/BF01045355
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effects of temperature and grain size on the deformation and fracture behaviour of recrystallized Ni3Al doped with boron were investigated by tensile tests at temperatures up to 973 K as a function of grain sizes from 1.6 to 105 μm. The yield stress showed a positive temperature dependence to a peak temperature in somewhat different manners depending on the grain size. For coarse-grained specimens, a rapid drop in elongation was observed with increasing temperature. The predominant fracture mode changed with temperature from the transgranular fracture of {1 1 1} cracking to brittle intergranular fracture. This embrittlement at elevated temperatures was considered to occur by a high stress concentration at grain boundaries arising from increased flow stress level and the occurrence of grain boundary sliding (GBS). In contrast, the elongation was not so markedly decreased with temperature for intermediate- and fine-grained specimens which exhibited ductile intergranular fracture and cavitation fracture, respectively, at elevated temperatures, and a slant-type fracture and cup-cone fracture, respectively, at low temperatures. The suppression of serious high-temperature embrittlement for intermediate-grained specimens was explained in terms of the slow propagation of a crack formed by GBS, owing to stress relaxation by dynamic recrystallization (DR) and plastic deformation. In the case of ultra-fine-grained specimens a large elongation was developed at elevated temperatures, which was interpreted as that the further occurrence of DR with increasing volume fraction of grain boundaries reduces the cavitation promoted by GBS, and that the limited sliding length due to extremely small grain diameter raises the stress for cavity formation. © 1990 Chapman and Hall Ltd.
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页码:1590 / 1597
页数:8
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