MODEL TO EXPLAIN THE ELECTRICAL BEHAVIOR OF P-TYPE SILICON SURFACES AFTER A CHEMICAL TREATMENT

被引:8
作者
VIEWEGGUTBERLET, FG
SIEGESLEITNER, PF
机构
[1] Wacker-Chemitronic GmbH, Material Characterization Section
关键词
resistivity; semiconductor; water;
D O I
10.1149/1.2128798
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Chemical pretreatment prior to electrical measurements of silicon wafers of p-type conductivity often results in unstable and unreliable readings of resistivity or carrier concentration. In a previous publication (1) we showed that the strongest effect can be achieved by dipping the wafer into hydrofluoric acid (HF) prior to the electrical measurements. In this paper we present a model to explain the effect of resistivity shift (shift in hole concentration) by a capture of holes to the surface and the diffusion of hydrogen atoms (protons) into the silicon to compensate free charges and to rebuild the steady-state equilibrium conditions in the semiconductor. © 1979, The Electrochemical Society, Inc. All rights reserved.
引用
收藏
页码:1792 / 1794
页数:3
相关论文
共 3 条
[1]  
Baron R., COMMUNICATION
[2]  
EHRSTEIN J, 1974, JUN SPREAD RES S AST
[3]  
VIEWEGGUTBERLET FG, 1977, SEMICONDUCTOR SILICO, P387