3-DIMENSIONAL ELECTROMAGNETIC ANALYSIS OF SHIELDED MICROSTRIP CIRCUITS

被引：14

作者：

HILL, A

BURKE, J

KOTTAPALLI, K

机构：

[1] Compact Software, Inc., Paterson, New Jersey, 07504

来源：

INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE COMPUTER-AIDED ENGINEERING | 1992年 / 2卷 / 04期

关键词：

D O I：

10.1002/mmce.4570020410

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

The spectral domain integral equation approach is employed for the characterization of passive microstrip circuits that cannot be analyzed using the traditional lumped-circuit-based approach. General planar and certain three-dimensional structures such as vias and air bridges are analyzed using the presented technique. Spurious mode coupling and the effect of the microwave housing on circuit performance are also investigated.

引用

页码：286 / 296

页数：11

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