SIMULATION OF COUPLED ELECTROMAGNETIC AND HEAT DISSIPATION PROBLEMS

被引：14

作者：

JANSSEN, HHJM

TERMATEN, EJW

VANHOUWELINGEN, D

机构：

[1] Philips Electronics N.V., Philips Research Laboratories, JA Eindhoven, P.O. Box 80,000

来源：

IEEE TRANSACTIONS ON MAGNETICS | 1994年 / 30卷 / 05期

关键词：

D O I：

10.1109/20.312651

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A description is given of an integrated simulation environment for the solution of coupled electromagnetic and heat dissipation problems in two dimensions, in particular for the field of induction heating, dielectric heating, and hysteresis heating. The equations are coupled because the most important physical parameters (permeability, conductivity, permittivity) may depend on temperature in a nonlinear way. The software has been constructed with the high level language PDL, using the general 'Mammy' design concept. All heating problems under consideration may involve thermal convection and radiation at the boundaries of the objects. Also, additional temperature dependent heat sources (e.g. resistor heating) can be defined. One can include instantaneous effects of movement in the plane on the temperature transfer. Effects around Curie temperature transitions can be analyzed.

引用

页码：3331 / 3334

页数：4

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