THE EFFECT OF REFLOW PROCESS VARIABLES ON THE WETTABILITY OF LEAD-FREE SOLDERS

被引：54

作者：

MELTON, C

机构：

[1] Corporate Manufacturing Research Center of Motorola, Schaumburg, Illinois

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1993年 / 45卷 / 07期

关键词：

D O I：

10.1007/BF03222378

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A quantitative dynamic solder wettability measurement was utilized to evaluate the effects of reflow processing on the wettability parameters associated with the lead-free solders 96.5Sn-3.5Ag and 58Bi-42Sn. Solder wettability was determined with respect to the final degree of spread and the extent of solder wetting onto the terminal areas of surface-mount components. The solder alloy composition of 96.5Sn-3.5Ag exhibited better wetting characteristics than the 58Bi-42Sn alloy. This wetting behavior was enhanced under the reflow conditions of a nitrogen atmosphere and the use of a gold metallization. The wetting of the conventional 63Sn-37Pb solder alloy was improved over the comparatively processed 58Bi-42Sn alloy. However, the 63Sn-37Pb solder alloy displayed a greater sensitivity to reflow atmosphere than the 96.5Sn-3.5Ag alloy, which generally exhibited better wetting characteristics than the Sn-Pb alloy.

引用

页码：33 / 35

页数：3