HIGH-RESOLUTION TEMPERATURE-MEASUREMENT OF VOID DYNAMICS INDUCED BY ELECTROMIGRATION IN ALUMINUM METALLIZATION

被引：25

作者：

KONDO, S ^{[1
]}

HINODE, K ^{[1
]}

机构：

[1] HITACHI LTD,CENT RES LAB,KOKUBUNJI,TOKYO 185,JAPAN

来源：

APPLIED PHYSICS LETTERS | 1995年 / 67卷 / 11期

关键词：

D O I：

10.1063/1.114954

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The local temperature of aluminum metallization is measured directly during electromigration. High resolution thermography is used to detect void dynamics induced by a de current. In the vicinity of the growing area, infrared radiation pulses less than 0.5 s wide are observed concomitant with resistance pulses. Their amplitudes are found to correspond to a temperature increase of more than 200 degrees C, which locally exceeds the melting point of aluminum metallization. These pulses occur as a consequence of void movement. Healing of voids is discussed along with the results. (C) 1995 American Institute of Physics.

引用

页码：1606 / 1608

页数：3

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