THERMAL DIFFUSIVITIES OF COMPOSITES WITH VARIOUS TYPES OF FILLER

被引：66

作者：

HATTA, H

TAYA, M

KULACKI, FA

HARDER, JF

机构：

[1] UNIV WASHINGTON,DEPT MECH ENGN,SEATTLE,WA 98195

[2] MITSUBISHI ELECTR CORP,MAT & ELECTR DEVICES LAB,SAGAMIHARA,KANAGAWA 229,JAPAN

[3] COLORADO STATE UNIV,COLL ENGN,FT COLLINS,CO 80523

来源：

JOURNAL OF COMPOSITE MATERIALS | 1992年 / 26卷 / 05期

关键词：

D O I：

10.1177/002199839202600501

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

In-plane and out-of-plane thermal diffusivities (conductivities) of Kerimid resin composites reinforced with various types of filler were studied both experimentally and theoretically. The types of filler used are SiO2 particle, Al2O3 short fiber, Boron Nitride (BN) flake, and Si3N4 whisker. The prediction based on our previous model (Eshelby's equivalent inclusion method) agreed reasonably well with the experiment, except for BN flake composite. It was found that the orientation of filler has a strong effect on the overall thermal conductivity of a composite.

引用

页码：612 / 625

页数：14

共 18 条

[1]

[Anonymous], 1892, PHILOS MAG

[2]

CHRISTENSEN RM, 1979, MECHANICS COMPOSITE

[3] THE DETERMINATION OF THE ELASTIC FIELD OF AN ELLIPSOIDAL INCLUSION, AND RELATED PROBLEMS [J].