ON PHYSICS OF PURPLE-PLAGUE FORMATION AND OBSERVATION OF PURPLE PLAGUE IN ULTRASONICALLY-JOINED GOLD-ALUMINUM BONDS

被引:14
作者
CHEN, GKC
机构
来源
IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING | 1967年 / PMP3卷 / 04期
关键词
D O I
10.1109/TPMP.1967.1135733
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:149 / &
相关论文
共 31 条
[1]   SEMICONDUCTOR NETWORK RELIABILITY ASSESSMENT [J].
ADAMS, J ;
WORKMAN, W .
PROCEEDINGS OF THE IEEE, 1964, 52 (12) :1624-&
[2]   TECHNIQUE FOR CONNECTING ELECTRICAL LEADS TO SEMICONDUCTORS [J].
ANDERSON, OL ;
CHRISTENSEN, H ;
ANDREATCH, P .
JOURNAL OF APPLIED PHYSICS, 1957, 28 (08) :923-923
[4]  
BERNSTEIN L, 1961, SEMINCONDUCTOR PROD
[5]  
BLECH IA, 1966, J ELECTROCHEM SOC, V113, P1052
[6]   QUENCHING VACANCIES IN GOLD [J].
BRADSHAW, FJ ;
PEARSON, S .
PHILOSOPHICAL MAGAZINE, 1957, 2 (15) :379-383
[7]   QUENCHING VACANCIES IN ALUMINIUM [J].
BRADSHAW, FJ ;
PEARSON, S .
PHILOSOPHICAL MAGAZINE, 1957, 2 (16) :570-571
[8]  
BROWNING GB, 1966, PHYSICS FAILURE ELEC, V4
[9]  
Coffinberry AS, 1938, T AM I MIN MET ENG, V128, P249
[10]  
COLTERYAHN LE, 1965 IEEE WESCON INT