HOLLOW-CATHODE DISCHARGE SPUTTERING DEVICE FOR UNIFORM LARGE AREA THIN-FILM DEPOSITION

被引：37

作者：

KOCH, H

FRIEDRICH, LJ

HINKEL, V

LUDWIG, F

POLITT, B

SCHURIG, T

机构：

[1] Physikalisch-Techn Bundesanstalt, Institut Berlin, W-1000 Berlin 10

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1991年 / 9卷 / 04期

关键词：

D O I：

10.1116/1.577279

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Hollow cathode discharges produce higher densities of sputtered particles than conventional discharges and can be utilized for thin film deposition. A prototype hollow cathode sputter source has therefore been built and tested. The deposition of copper and the superconductor YBa2Cu3O7-x produced thin films of good quality. The method can be upscaled for a uniform deposition of tapes, wires, large-area substrates, and for the parallel deposition of multiple substrates.

引用

页码：2374 / 2377

页数：4

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