MODELING OF LASER PLANARIZATION OF THIN METAL-FILMS

被引：15

作者：

MARELLA, PF ^{[1
]}

TUCKERMAN, DB ^{[1
]}

PEASE, RF ^{[1
]}

机构：

[1] UNIV CALIF LAWRENCE LIVERMORE NATL LAB,DIV SPECIAL STUDIES,LIVERMORE,CA 94550

来源：

关键词：

D O I：

10.1063/1.100772

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1109 / 1111

页数：3

共 13 条

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[6] MARELLA PF, 1989, MRS S P, V129
[7] HIGH-ASPECT-RATIO VIA-HOLE FILLING WITH ALUMINUM MELTING BY EXCIMER LASER IRRADIATION FOR MULTILEVEL INTERCONNECTION
MUKAI, R
SASAKI, N
NAKANO, M
[J]. IEEE ELECTRON DEVICE LETTERS, 1987, 8 (02) : 76 - 78
[8] Touloukian Y.S., 1973, THERMOPHYSICAL PROPE, V10, P1
[9] Touloukian Y. S., 1973, THERMOPHYSICAL PROPE, V2
[10] TOULOUKIAN YS, 1973, THERMOPHYSICAL PROPE, V1