EFFECT OF COMPOSITION AND ORDERING ON ADHESION IN SOME BINARY SOLID SOLUTION ALLOY SYSTEMS

A twist compression bonding technique is described which is used to determine the coefficient of adhesion in air for alloys of a variety of compositions from the solid solution systems Cu-Au, Cu-Ni, Au-Ag, Ag-Pd and Pt-Co. It is shown that the coefficient of adhesion depends on chemical composition and changes in crystal structure produced by atomic ordering. Data, with the exception of that for the Cu-Ni alloys containing less than 41 at.% Cu, are interpreted in terms of changes in hardness. The changes in hardness are in turn related to the processes of solute and order hardening. It is shown that the apparently anomalous data for the Cu-Ni alloys can be correlated with changes in stacking fault energy produced by changes in copper content. © 1969.