METALLURGICAL BOUNDARY PROPERTIES AND ELECTROPHYSICAL PROPERTIES OF MOLYBDENUM-SILICON JUNCTIONS

被引：5

作者：

ALEKSANDROV, LN ^{[1
]}

GERSHINSKII, AE ^{[1
]}

LOVYAGIN, RN ^{[1
]}

SIMONOV, PA ^{[1
]}

FOMIN, BI ^{[1
]}

CHEREPOV, EI ^{[1
]}

机构：

[1] ACAD SCI USSR,INST SEMICOND PHYS,NOVOSIBIRSK 90,USSR

来源：

THIN SOLID FILMS | 1977年 / 45卷 / 01期

关键词：

D O I：

10.1016/0040-6090(77)90208-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：87 / 93

页数：7

共 8 条

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[5] INVESTIGATION OF REACTIVE DIFFUSION IN THIN-FILM SYSTEM CU-TI [J].

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[7]

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[8]

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