共 1 条
CALCULATION OF DENSITY OF PEROXYL BONDS IN SIO2
被引:1
作者:
ARAUJO, R
机构:
[1] Corning Incorporated, Corning
关键词:
D O I:
10.1016/0022-3093(91)90470-Q
中图分类号:
TQ174 [陶瓷工业];
TB3 [工程材料学];
学科分类号:
0805 ;
080502 ;
摘要:
The density of silicon-silicon bonds and of peroxyl bonds in silica was calculated for a simple model. The calculated density of peroxyl bonds was much lower than the value extracted from a hydrogenation experiment. Explanations of the discrepancy are discussed.
引用
收藏
页码:326 / 327
页数:2
相关论文