CONSEQUENCES OF THE COOLING INDUCED BY VOLTAGE TAPS AT THE EXTREMITIES OF ELECTROMIGRATION TEST STRUCTURES

被引：3

作者：

JEULAND, F ^{[1
]}

LORMAND, G ^{[1
]}

NORMANDON, P ^{[1
]}

BOUDOU, A ^{[1
]}

机构：

[1] CTR NATL ETUD TELECOMMUN,F-38243 MEYLAN,FRANCE

来源：

JOURNAL OF APPLIED PHYSICS | 1992年 / 71卷 / 04期

关键词：

D O I：

10.1063/1.351141

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The difference between the rupture localizations observed on two types of electromigration test structures, with or without several width variations, is explained by the effect of the cooling due to voltage taps at the extremities of the structures. The influence of this cooling on the ion flow divergence resulting from the thermal gradient at the extremities of the test structures is studied. Whereas a current density acceleration exponent of 3 is found for temperature-gradient-induced failures at moderated current densities, a value of 1 is predicted for high-current-density accelerated tests.

引用

页码：2015 / 2017

页数：3

共 10 条

[1] ELECTROMIGRATION FAILURE MODES IN ALUMINUM METALLIZATION FOR SEMICONDUCTOR DEVICES [J].