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3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy.[J].LayWai Kong;Andrew C. Rudack;Peter Krueger;Ehrenfried Zschech;Sitaram Arkalgud;A.C. Diebold.Microelectronic Engineering.2011,
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Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits.[J].Libo Qian;Zhangming Zhu;Yintang Yang.Microelectronics Journal.2011, 2
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Synthesis of novel pompon-like porous SnO 2 and its application in lithium-ion battery.[J].Xiaolei Sun;Xinghui Wang;Yanli Qin;Xiuwan Li;Li Qiao;Na Feng;Duokai Hu;Deyan He.Materials Letters.2011, 1

