SMOOTH POLYCRYSTALLINE CERAMIC SUBSTRATES WITH ENHANCED METAL ADHESION BY PULSED EXCIMER-LASER PROCESSING

被引：18

作者：

LOWNDES, DH

DESILVA, M

GODBOLE, MJ

PEDRAZA, AJ

THUNDAT, T

WARMACK, RJ

机构：

[1] UNIV TENNESSEE,DEPT MAT SCI & ENGN,KNOXVILLE,TN 37996

[2] UNIV TENNESSEE,DIV HLTH & SAFETY RES,KNOXVILLE,TN 37996

来源：

APPLIED PHYSICS LETTERS | 1994年 / 64卷 / 14期

关键词：

D O I：

10.1063/1.111810

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Multishot pulsed XeCl (308 nm) excimer laser irradiation of commercial fine-grained polycrystalline alumina substrates is found to significantly improve their properties for metal film-bonding-applications. A smoother surface finish is obtained, and the adhesion strength of subsequently deposited copper films to the laser-treated alumina surface is increased by a factor of 3-5 (200%-400%) under optimum laser conditions. Smoothing occurs when the alumina melts and undergoes molten flow before resolidifying. XPS measurements suggest that electrical activation of the near-surface region also may contribute to the enhanced copper adhesion.

引用

页码：1791 / 1793

页数：3

共 17 条

[1] CONSEQUENCES OF SIMULTANEOUS EXPOSURE OF INORGANIC SOLIDS TO EXCIMER LASER-LIGHT AND AN ELECTRON-BEAM [J].