We report on progress in the development of submicron area mixer elements for operation in the submillimeter wave range. High current density NbN/MgO/NbN tunnel junctions with areas down to 0.1-mu-m2 have been fabricated in both planar and edge geometries. The planar junctions were fabricated from insitu deposited trilayers using electron-beam lithography to pattern submicron area mesas. Modifications of fabrication techniques used in larger area NbN tunnel junctions are required and will be discussed. The NbN/MgO/NbN edge junction process using sapphire substrates reported earlier has been transferred to technologically important quartz substrates using MgO buffer layers to minimize substrate interactions. The two junction geometries will be compared and contrasted in the context of submillimeter wave mixer applications.