MULTICHIP PACKAGING TECHNOLOGY WITH LASER-PATTERNED INTERCONNECTS

被引：2

作者：

BARFKNECHT, AT ^{[1
]}

TUCKERMAN, DB ^{[1
]}

KASCHMITTER, JL ^{[1
]}

MCWILLIAMS, BM ^{[1
]}

机构：

[1] UNIV CALIF LAWRENCE LIVERMORE NATL LAB, LIVERMORE, CA 94550 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期

关键词：

D O I：

10.1109/33.49028

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：646 / 649

页数：4

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