DIFFUSION BEHAVIOR OF AU/NI BILAYERS DEPOSITED BY ELECTRON-BEAM EVAPORATION AND SPUTTERING ONTO MASSIVE COPPER SUBSTRATES

被引：5

作者：

BENHENDA, S

GUGLIELMACCI, JM

GILLET, M

PECH, T

机构：

[1] ECOLE SUPER ELECT,GENIE ELECT PARIS LAB,CNRS,LAB 127,F-91190 GIF SUR YVETTE,FRANCE

[2] FAC SCI & TECH ST JEROME,MICROSCOPIE & DIFFRACT ELECTR LAB,CNRS,UA 797,F-13397 MARSEILLE 13,FRANCE

来源：

APPLIED SURFACE SCIENCE | 1987年 / 28卷 / 03期

关键词：

D O I：

10.1016/0169-4332(87)90123-1

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

引用

页码：215 / 223

页数：9

共 10 条

[1] CLASSIFICATION AND DIFFUSION BEHAVIOR OF NICKEL FILMS DEPOSITED ON THE COPPER SUBSTRATE BY ELECTRON-BEAM EVAPORATION, SPUTTERING AND ELECTRODEPOSITION [J].

BENHENDA, S ;

GUGLIELMACCI, JM ;

GILLET, M ;

PECH, T .

APPLIED SURFACE SCIENCE, 1986, 25 (1-2) :53-67

[2] SCANNING AUGER MICRO-PROBE STUDY OF GOLD-NICKEL-COPPER DIFFUSION IN THIN-FILMS [J].

BRADY, TE ;

HOVLAND, CT .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 18 (02) :339-342

[3]

CHATTERJEE A, 1968, J I MET, V96, P186

[4] COPPER TRANSPORT ACROSS A PROTECTIVE GOLD THIN-FILM [J].

GILLET, M ;

GUGLIELMACCI, JM ;

BENHENDA, S ;

PECH, T .

APPLIED SURFACE SCIENCE, 1985, 24 (01) :1-10

[5] AUGER SPECTROMETRY STUDY OF THE GROWTH OF A GOLD DEPOSIT IN NICKEL ACCORDING TO THE SUBSTRATE-TEMPERATURE [J].

GUGLIELMACCI, JM .

APPLIED SURFACE SCIENCE, 1984, 17 (03) :337-343

[6] FORMALISM FOR EXTRACTING DIFFUSION-COEFFICIENTS FROM CONCENTRATION PROFILES [J].

HALL, PM ;

MORABITO, JM .

SURFACE SCIENCE, 1976, 54 (01) :79-90

[7]

HILA F, 1981, THESIS MARSEILLE

[8]

Judy M. M., 1973, Journal of Electronic Materials, V2, P331, DOI 10.1007/BF02666161

[9]

PINES BY, 1967, UKRAIN PHYS J, V13, P194

[10] QUALITATIVE OBSERVATIONS ON DIFFUSION OF COPPER AND GOLD THROUGH A NICKEL BARRIER [J].

PINNEL, MR ;

BENNETT, JE .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1976, 7 (05) :629-635

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