CLASSIFICATION AND DIFFUSION BEHAVIOR OF NICKEL FILMS DEPOSITED ON THE COPPER SUBSTRATE BY ELECTRON-BEAM EVAPORATION, SPUTTERING AND ELECTRODEPOSITION

被引:6
作者
BENHENDA, S
GUGLIELMACCI, JM
GILLET, M
PECH, T
机构
[1] FAC SCI & TECH ST JEROME,CNRS,UA 797,MICROSCOPIE & DIFFRACT ELECTR LAB,F-13397 MARSEILLE 13,FRANCE
[2] ECOLE SUPER ELECT,CNRS,GENIE ELECT PARIS LAB 127,F-91190 GIF SUR YVETTE,FRANCE
关键词
COPPER AND ALLOYS - ELECTRODEPOSITION - NICKEL AND ALLOYS;
D O I
10.1016/0169-4332(86)90025-5
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Nickel films are deposited on thick copper substrate by electron beam evaporation, sputtering and electrodeposition. The film structure is characterized by Transmission Electron Microscopy. The diffusion of Cu through Ni films is investigated by Auger electron spectroscopy using the method of the 'first arrival'. The diffusion anneals are performed between 300 and 450 degree C. Electroplated Ni films show more effective barrier diffusion for Cu than in the case of vacuum deposited films. This is mainly due to larger grain size.
引用
收藏
页码:53 / 67
页数:15
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