AUGER STUDY OF INTER-DIFFUSION IN CU/NI THIN-FILMS

被引：15

作者：

LEWIS, JE

HO, PS

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1982年 / 20卷 / 03期

关键词：

D O I：

10.1116/1.571335

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：466 / 466

页数：1

共 6 条

[1] Coburn J. W., 1974, Critical Reviews in Solid State Sciences, V4, P561, DOI 10.1080/10408437308245843
[2] Gjostein N. A., 1973, DIFFUSION, P241
[3] Gupta D., 1978, Thin films. Interdiffusion and reactions, P161
[4] COMPOSITIONAL DEPTH PROFILING BY AUGER-ELECTRON SPECTROSCOPY
HALL, PM
MORABITO, JM
[J]. CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1978, 8 (01): : 53 - 67
[5] AUGER STUDY OF PREFERRED SPUTTERING ON BINARY ALLOY SURFACES
HO, PS
LEWIS, JE
WILDMAN, HS
HOWARD, JK
[J]. SURFACE SCIENCE, 1976, 57 (01) : 393 - 405
[6] INTER-DIFFUSION OF THIN BILAYERS OF COPPER AND NICKEL
SUNI, I
NICOLET, MA
MAENPAA, M
[J]. THIN SOLID FILMS, 1981, 79 (01) : 69 - 73