DEPTH RESOLUTION IN SIMS STUDY OF BORON DELTA-DOPING IN EPITAXIAL SILICON

被引:9
作者
DUPUY, JC [1 ]
PRUDON, G [1 ]
DUBOIS, C [1 ]
WARREN, P [1 ]
DUTARTRE, D [1 ]
机构
[1] CNET,CNS,F-38243 MEYLAN,FRANCE
关键词
D O I
10.1016/0168-583X(94)95848-3
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Microelectronic needs accurate analysis of very thin layers as delta doped structures. By secondary ion mass spectrometry (SIMS) with O2+ ion beam, we analyse mono-delta of boron in silicon located at 30 nm under the surface and then a multi-delta of boron in silicon located just under the surface (almost-equal-to 10 nm). For the mono-delta, we study modifications of the SIMS profiles within the projected range of primary ion beam R(p). From the dependence of FWHM within R(p), we deduce the real thickness of pseudo-delta thin layers by assuming a convolution process for SIMS measurements. This assumption is well confirmed by the analysis of a boron tri-delta doped layers.
引用
收藏
页码:379 / 382
页数:4
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