SPIN DEPOSITION OF POLYMERS OVER HOLES AND CAVITIES

被引:2
作者
ELDERSTIG, H
WALLGREN, P
机构
[1] Industrial Microelectronics Center, Kista, S-164 21
关键词
MICROSTRUCTURES; POLYMERS; SPIN DEPOSITION;
D O I
10.1016/0924-4247(94)00869-J
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we report how polymers can be spin deposited on a perforated membrane in order to seal the holes in it. This is a few-temperature and potentially low-cost process that is compatible with VLSI processing techniques. The method has been demonstrated on a capacitive pressure sensor. This shows that it has the potential of being widely used in future microstructures.
引用
收藏
页码:95 / 97
页数:3
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