OPTICAL INTERCONNECTS USING TOP-SURFACE-EMITTING MICROLASERS AND PLANAR OPTICS

被引：23

作者：

JAHNS, J ^{[1
]}

LEE, YH ^{[1
]}

BURRUS, CA ^{[1
]}

JEWELL, JL ^{[1
]}

机构：

[1] AT&T BELL LABS,CRAWFORD HILL LAB,HOLMDEL,NJ 07733

来源：

APPLIED OPTICS | 1992年 / 31卷 / 05期

关键词：

OPTICAL INTERCONNECTS; OPTICAL PACKAGING; DIFFRACTIVE OPTICS; MICROOPTICS;

D O I：

10.1364/AO.31.000592

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Optical interconnections made using two-dimensional arrays of top-surface-emitting microlasers and integrated free-space optics are discussed for use in chip-to-chip communications. A demonstration setup with a 2 x 2 array of lasers is presented. System parameters, such as light efficiency, the number of data channels, thermal effects, power requirements, and the issue of hybrid integration of laser chips with passive optics, are considered.

引用

收藏

页码：592 / 597

页数：6

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