VOID GROWTH IN THIN SILVER FILMS

被引：15

作者：

SHARMA, SK ^{[1
]}

SPITZ, J ^{[1
]}

机构：

[1] CEN,ETUDE MAT MINCES LAB,F-38041 GRENOBLE,FRANCE

来源：

THIN SOLID FILMS | 1980年 / 67卷 / 01期

关键词：

D O I：

10.1016/0040-6090(80)90294-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：109 / 116

页数：8

共 11 条

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[2]

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JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1959, 14 (10) :1308-1313

[4] STRESS ANNEALING IN COPPER FILMS [J].

HOFFMAN, RW ;

STORY, HS .

JOURNAL OF APPLIED PHYSICS, 1956, 27 (02) :193-193

[5] VOIDS IN THIN AS-DEPOSITED GOLD-FILMS PREPARED BY VAPOR-DEPOSITION [J].

LLOYD, JR ;

NAKAHARA, S .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01) :655-659

[6]

MULLINS WW, 1960, T AM I MIN MET ENG, V218, P354

[7] THEORY OF THERMAL GROOVING [J].

MULLINS, WW .

JOURNAL OF APPLIED PHYSICS, 1957, 28 (03) :333-339

[8]

OSIPOV KA, 1964, ACTIVATION PROCESSES, P37

[9]

SHARMA SD, UNPUBLISHED

[10]

SHARMA SK, PHILOS MAG

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