OXYGEN EMBRITTLEMENT OF COPPER LEADS

被引：3

作者：

PANOUSIS, NT

WONSIEWICZ, BC

CONDRA, LW

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

[2] BELL TEL LABS INC,MURRAY HILL,NJ 07974

[3] BELL TEL LABS INC,N ANDOVER,MA 01845

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1977年 / 13卷 / 02期

关键词：

D O I：

10.1109/TPHP.1977.1135182

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：127 / 132

页数：6

共 11 条

[1]

Edelson B.I., 1962, T ASM, V55, P230

[2] STRENGTH OF GOLD-PLATED COPPER LEADS ON THIN-FILM CIRCUITS UNDER ACCELERATED AGING [J].

HALL, PM ;

PANOUSIS, NT ;

MENZEL, PR .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03) :202-205

[3]

JOHNSON DR, 1975, P INT SOC HYBRID ELE, P296

[4]

JOHNSON DR, 1976, P ELECTRONIC COMPONE, P80

[5]

MCCLINTOCK F, 1966, MECHANICAL BEHAVIOR

[6]

PALIWODA EJ, 1964, MECHANICAL WORKING S

[7] EFFECTS OF GOLD AND NICKEL PLATING THICKNESSES ON STRENGTH AND RELIABILITY OF THERMOCOMPRESSION-BONDED EXTERNAL LEADS [J].

PANOUSIS, NT ;

HALL, PM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (04) :282-288

[8]

RHINES WJ, 1961, THESIS MASSACHUSETTS

[9]

THOMASON PF, 1968, J I MET, V96, P360

[10]

WONSIEWICZ BC, TO BE PUBLISHED

← 1 2 →