Error budget analysis of the SCALPEL(R) mask for sub-0.2 mu m lithography

In this article we derive the design constraints, and hence the fabrication requirements, for the SCALPEL (R) mask for sub-0.2 mu m design rules. These are determined by the Semiconductor Industry Association (SIA) advanced mask specifications, in combination with the likely error budget of an advanced pattern generator. Further constraints are imposed by the overall SCALPEL system error budget. We demonstrate that the mask is not only technically feasible to construct, but also that it can be fabricated at an acceptable cost. (C) 1995 American Vacuum Society.