MULTICHIP PACKAGING FOR HIGH-SPEED SUPERCONDUCTING CIRCUITS

被引：13

作者：

SANDELL, RD

AKERLING, G

SMITH, AD

机构：

[1] TRW Space and Electronics Group, Redondo Beach, CA. 90278, One Space Park

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 1995年 / 5卷 / 02期

关键词：

D O I：

10.1109/77.403262

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We report the development of a multi-chip module (MCM) technology using Nh metallization and benzocyclobutene (BCB) polymer dielectric. The Nb/BCB structure displays very low loss, has low processing temperature, and forms a wide range of microstrip transmission line impedances. We are developing flip chip, solder attachment for die mounting. We also report the electrical characterization of Nb/BCB/Nb for both microstrip resonators, delay lines, and bandpass filters.

引用

页码：3160 / 3163

页数：4

共 8 条

[1] OVERVIEW OF JOSEPHSON PACKAGING [J].