RELIABILITY EVALUATION OF ELECTRONIC DEVICES

被引：4

作者：

KAWAI, S

NISHIMURA, A

HATTORI, T

KITANO, M

SHIMIZU, T

机构：

[1] Mechanical Engineering Research laboratory, Hitachi, Ltd. 502, Tsuchiura-shi, Ibaraki-ken, 300, Kandatsu-machi

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1991年 / 143卷 / 1-2期

关键词：

Bonding Wires - Plastic Encapsulants - Silicon Chips - Solder Joints - Thermal Oxidation;

D O I：

10.1016/0921-5093(91)90744-8

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Stresses due to thermal oxidation and film deposition processes during the fabrication of a semiconductor are analysed. The strengths of plastic encapsulants, silicon chips, bonding wires and adhesive interfaces in integrated-circuit (IC) plastic packages are evaluated using fracture mechanics and other techniques. The thermal fatigue strength of solder joints is then estimated using the fatigue test data of solder specimens and simplified modelling of IC packages.

引用

页码：247 / 256

页数：10

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