TRANSIENT THERMAL FRACTURE OF AN INTERFACE CRACK IN THE PRESENCE OF A SURFACE CRACK

被引:13
作者
KOKINI, K
TAKEUCHI, Y
机构
[1] School of Mechanical Engineering, Purdue University Ray W. Herrick Laboratories, West Lafayette, IN
关键词
D O I
10.1080/01495739408946246
中图分类号
O414.1 [热力学];
学科分类号
摘要
The effect of a surface crack on the strain energy release rate G(i) for an interface crack between two dissimilar materials subjected to a transient thermal load is studied It is shown that the presence of a surface crack is detrimental to the interface crack. Consideration of the surface crack shows that the longest crack does not experience the largest G(s). A top layer with the smallest modulus of elasticity and a thermal expansion coefficient approximately 10 percent smaller than that of the bottom layer results in the smallest maximum strain energy release rates for both cracks.
引用
收藏
页码:63 / 74
页数:12
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