FORMING FEEDTHROUGHS IN LASER-DRILLED HOLES IN SEMICONDUCTOR WAFERS BY DOUBLE-SIDED SPUTTERING

被引：2

作者：

ANTHONY, TR

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1982年 / 5卷 / 01期

关键词：

D O I：

10.1109/TCHMT.1982.1135926

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：171 / 180

页数：10

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[4]

BLUM W, 1949, PRINCIPLES ELECTROPL, P298

[5]

CHOPRA KL, 1964, THIN FILM PHENOMENA, P172

[6]

DAVIS RH, 1974, J VAC SCI TECHNOL, V11, P77, DOI 10.1116/1.1318665

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JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (01) :88-91

[8]

KOCHER E, 1972, IEEE J QUANTUM ELECT, V18, P120

[9]

SCHAEFER DH, 1979, 2ND P AIAA COMP AER, P284

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