LIQUID COOLING OF MICROELECTRONIC DEVICES BY FREE AND FORCED CONVECTION

被引：50

作者：

BAKER, E

机构：

来源：

MICROELECTRONICS AND RELIABILITY | 1972年 / 11卷 / 02期

关键词：

D O I：

10.1016/0026-2714(72)90704-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：213 / &

共 18 条

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BAKER, E
[J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1966, 9 (05) : 417 - &
[2] BATCH AT, 1970, ELECTRON PACKAG PROD, V10, P38
[3] CASAZZA SA, 1970, 1970 IEEE EAST EL PA
[4] PACKAGING AND COOLING PROBLEMS ASSOCIATED WITH MICROELECTRONICS EQUIPMENT
HONNOR, F
THOMAS, MA
[J]. MICROELECTRONICS RELIABILITY, 1969, 8 (04) : 331 - &
[5] KREITH F, 1958, PRINCIPLES HEAT TRAN, pCH8
[6] KREITH F, 1958, PRINCIPLES HEAT TRAN, pCH7
[7] KREITH F, 1958, PRINCIPLES HEAT TRAN, pCH9
[8] McAdams W.H., 1954, HEAT TRANSMISSION
[9] OKTAY S, 1970, ELECTRON PACKNG PROD, V10, P77
[10] PLEVYAK TJ, 1968, DEC ASME WINT ANN M