INTERNAL STRESS IN EVAPORATED SILVER AND GOLD FILMS

被引：44

作者：

WILCOCK, JD

CAMPBELL, DS

ANDERSON, JC

机构：

[1] Electrical Engineering Department, Imperial College, London

来源：

THIN SOLID FILMS | 1969年 / 3卷 / 01期

关键词：

D O I：

10.1016/0040-6090(69)90108-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The internal stress in the initial stages of growth of evaporated silver and gold films on to glass and mica substrates has been measured using a bending beam method. The thermal stress contribution to the total stress has been calculated. The stresses observed were tensile. Intrinsic stress was found in island structure films. Stress relief immediately after film deposition was observed. The results have been interpreted in terms of a grain boundary annealing mechanism. © 1969.

引用

页码：13 / &

共 37 条

[1] ELECTRICAL RESISTANCES OF THIN METAL FILMS BEFORE AND AFTER ARTIFICIAL AGING BY HEATING [J].