ELECTROMIGRATION DAMAGE IN THIN FILMS DUE TO GRAIN BOUNDARY GROOVING PROCESSES

[1] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +

[2] ATTARDO MJ, PRIVATE COMMUNICATIO

[3] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +

[4] BLACK JR, 1969, IEEE T ELECTRON DEVI, VED16, P338

[5] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[6] EFFECT OF HIGH ELECTRONIC CURRENT DENSITY ON MOTION OF AU195 AND SB125 IN GOLD [J]. PHYSICAL REVIEW, 1966, 145 (02): : 507 - &

[7] HARTMAN TE, 1969, IEEE T ELECTRON DEVI, VED16, P407

[8] ELECTROMIGRATION EFFECTS IN ALUMINUM FILM ON SILICON SUBSTRATES [J]. APPLIED PHYSICS LETTERS, 1967, 11 (03) : 85 - &

[9] HOWARD JK, PRIVATE COMMUNICATIO

[10] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) : 76 - 87

[1] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +

[2] ATTARDO MJ, PRIVATE COMMUNICATIO

[3] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +

[4] BLACK JR, 1969, IEEE T ELECTRON DEVI, VED16, P338

[5] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[6] EFFECT OF HIGH ELECTRONIC CURRENT DENSITY ON MOTION OF AU195 AND SB125 IN GOLD [J]. PHYSICAL REVIEW, 1966, 145 (02): : 507 - &

[7] HARTMAN TE, 1969, IEEE T ELECTRON DEVI, VED16, P407

[8] ELECTROMIGRATION EFFECTS IN ALUMINUM FILM ON SILICON SUBSTRATES [J]. APPLIED PHYSICS LETTERS, 1967, 11 (03) : 85 - &

[9] HOWARD JK, PRIVATE COMMUNICATIO

[10] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) : 76 - 87