APPLICATION OF LINE-EDGE PROFILE SIMULATION TO THIN-FILM DEPOSITION PROCESSES

被引：28

作者：

NEUREUTHER, AR ^{[1
]}

TING, CH ^{[1
]}

LIU, CY ^{[1
]}

机构：

[1] IBM CORP,RES LAB,SAN JOSE,CA 95193

来源：

关键词：

D O I：

10.1109/T-ED.1980.20055

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1449 / 1455

页数：7

共 6 条

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[2] JONES AB, 1977, SOLID STATE TECH NOV, P66
[3] MODELING ION MILLING
NEUREUTHER, AR
LIU, CY
TING, CH
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (06): : 1767 - 1771
[4] A GENERAL SIMULATOR FOR VLSI LITHOGRAPHY AND ETCHING PROCESSES .2. APPLICATION TO DEPOSITION AND ETCHING
OLDHAM, WG
NEUREUTHER, AR
SUNG, C
REYNOLDS, JL
NANDGAONKAR, SN
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1980, 27 (08) : 1455 - 1459
[5] LIFT-OFF METALLIZATION OF SPUTTERED AL-ALLOY FILMS
SAKURAI, T
SERIKAWA, T
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (07) : 1257 - 1260
[6] TING CY, 1979, J VACUUM SCI TECHNOL, V15, P1105