SINGLE-CHIP INTEGRATION OF LIGHT-EMITTING DIODE, WAVE-GUIDE AND MICROMIRRORS

被引:13
作者
NAGATA, T [1 ]
NAMBA, T [1 ]
KURODA, Y [1 ]
MIYAKE, K [1 ]
MIYAMOTO, T [1 ]
YOKOYAMA, S [1 ]
MIYAZAKI, S [1 ]
KOYANAGI, M [1 ]
HIROSE, M [1 ]
机构
[1] HIROSHIMA UNIV,DEPT ELECT ENGN,HIGASHIHIROSHIMA 724,JAPAN
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1995年 / 34卷 / 2B期
关键词
OPTOELECTRONIC INTEGRATED CIRCUITS; SINGLE-CHIC INTEGRATION; OPTICAL WAVE-GUIDE; MICROMIRROR; LED; LOW-TEMPERATURE CHEMICAL VAPOR DEPOSITION;
D O I
10.1143/JJAP.34.1282
中图分类号
O59 [应用物理学];
学科分类号
摘要
Fundamental technologies for optical interconnection on a Si LSI chip have been developed using conventional silicon process technologies. The optical waveguides with SiOxNy core and SiO2 cladding layers and Al micromirrors to change the light propagation direction have been fabricated by low-temperature deposition. Moreover, the single test chip integrated with a light-emitting diode (LED), photodiode, waveguides and micromirrors has been fabricated and signal transfer between LED and the photodetector has been achieved.
引用
收藏
页码:1282 / 1285
页数:4
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