INCLUSIONS IN ELECTROPLATED ADDITIVE-FREE HARD GOLD

被引:22
作者
NAKAHARA, S
OKINAKA, Y
机构
关键词
D O I
10.1149/1.2127404
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:284 / 288
页数:5
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[21]  
NAKAHARA S, 1975, PROPERTIES ELECTRODE, pCH3
[22]   STRUCTURE OF ELECTROPLATED HARD GOLD OBSERVED BY TRANSMISSION ELECTRON-MICROSCOPY [J].
OKINAKA, Y ;
NAKAHARA, S .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (09) :1284-1289
[23]   POLYMER INCLUSIONS IN COBALT-HARDENED ELECTROPLATED GOLD [J].
OKINAKA, Y ;
KOCH, FB ;
WOLOWODIUK, C ;
BLESSINGTON, DR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (11) :1745-1750
[24]   CYANOAURATE(III) FORMATION AND ITS EFFECT ON CURRENT EFFICIENCY IN GOLD PLATING [J].
OKINAKA, Y ;
WOLOWODIUK, C .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1981, 128 (02) :288-294
[25]  
Raub Ch. J., 1976, PLATING, V63, P35
[26]   CARBON IN GOLD ELECTRODEPOSITS [J].
REINHEIMER, HA .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (04) :490-500
[27]   HIGH-TEMPERATURE FILM FORMATION ON COBALT-HARDENED GOLD [J].
THOMAS, JH ;
SHARMA, SP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (03) :445-449
[28]  
ZHDANOV H, 1945, ACTA PHYSICOCHIM USS, V20, P253