USE OF METHOD OF SUCCESSIVE DILUTION FOR REPRODUCIBLE CONTROL OF AL-CU ALLOY EVAPORATION

被引:2
作者
HECHT, LC [1 ]
机构
[1] IBM CORP,ENDICOTT,NY 13760
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1977年 / 14卷 / 01期
关键词
D O I
10.1116/1.569170
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:648 / 650
页数:3
相关论文
共 9 条
[1]   SURFACE DEPLETION IN 2-COMPONENT ALLOYS DURING EVAPORATION [J].
ARITA, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01) :530-530
[2]   THEORY OF STEADY-STATE EVAPORATION OF ALLOYS [J].
DALE, EB .
JOURNAL OF APPLIED PHYSICS, 1971, 42 (10) :3697-&
[3]  
DALE EB, 1963, T NAT VAC S, V348
[4]   EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J].
DHEURLE, FM .
METALLURGICAL TRANSACTIONS, 1971, 2 (03) :683-&
[5]  
HONIG RE, 1962, RCA REV, V23, P567
[6]  
HUIJER P, 1962, PHILIPS TECH REV, V24, P144
[7]   FAILURE OF ALUMINIUM CONTACTS TO SILICON IN SHALLOW DIFFUSED TRANSISTORS [J].
MCCARTHY, J .
MICROELECTRONICS RELIABILITY, 1970, 9 (02) :187-&
[8]   VACUUM DEPOSITION OF TIN-SELENIUM FILMS [J].
TERADA, T .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1971, 4 (12) :1991-&
[9]  
ZINSMEISTER G, 1963, VAK TECH, V8, P233