Screen printing and chip flipping techniques for large area hybrid pixel detectors bonding

被引：4

作者：

Bonvicini, V

Caccia, M

Mazzoni, P

Napoletano, C

Pindo, M

Redaelli, N

Samori, A

Vegni, G

机构：

[1] UNIV MILAN,DIPARTIMENTO FIS,I-20133 MILAN,ITALY

[2] IST NAZL FIS NUCL,SEZ MILANO,I-20133 MILAN,ITALY

[3] ENGN TEAM,I-47015 MODIGLIANA,ITALY

来源：

NUCLEAR PHYSICS B | 1995年

关键词：

D O I：

10.1016/0920-5632(95)00562-5

中图分类号：

O412 [相对论、场论]; O572.2 [粒子物理学];

学科分类号：

摘要：

In the last few years hybrid silicon pixel detectors came to use in high energy physics. One of the most serious problems is the realization of detectors and read out electronics interconnection at high density and low cost. For the upgrade in the forward direction of the DELPHI silicon vertex detector, it has been successfully carried out the bonding of pixel detectors to VLSI read out chips by means of conductive glue screen printing followed by a precise chip flipping procedure. The measured missing contact rate is (0.05+/-0.03)%.

引用

页码：409 / 413

页数：5

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