POTENTIAL APPLICATIONS OF AN ELECTRON-CYCLOTRON RESONANCE MULTICUSP PLASMA SOURCE

An electron cyclotron resonance (ECR) multicusp plasmatron has been developed by feeding a multicusp bucket arc chamber with a compact ECR plasma source. This novel source produces large (about 25 cm diam), uniform (to within ± 10%), dense ( > 1011cm−3) plasmas of argon, helium, hydrogen, and oxygen. It has been operated to produce an oxygen plasma for etching 12.7 cm (5 in.) positive photoresist-coated silicon wafers with uniformity within ±8%. Results and potential applications of this new ECR plasma source for plasma processing of thin films are discussed. © 1990, American Vacuum Society. All rights reserved.