IMPROVED MORPHOLOGY OF AU-BASED CONTACTS TO GAAS

被引:4
作者
BARCZ, AJ
机构
关键词
D O I
10.1109/EDL.1987.26602
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:200 / 201
页数:2
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共 9 条
[1]  
BARCZ AJ, IN PRESS THIN SOLID
[2]  
KAMINSKA E, 1984, 6TH INT C THIN FILMS
[3]  
KAMINSKA E, 1984, Patent No. 253317
[4]   MODEL PREDICTIONS FOR THE ENTHALPY OF FORMATION OF TRANSITION-METAL ALLOYS .2. [J].
NIESSEN, AK ;
DEBOER, FR ;
BOOM, R ;
DECHATEL, PF ;
MATTENS, WCM .
CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 1983, 7 (01) :51-70
[6]   OHMIC CONTACTS TO III-V-COMPOUND SEMICONDUCTORS - A REVIEW OF FABRICATION TECHNIQUES [J].
PIOTROWSKA, A ;
GUIVARCH, A ;
PELOUS, G .
SOLID-STATE ELECTRONICS, 1983, 26 (03) :179-&
[7]  
REMBA RD, 1985, IEEE ELECT DEV LETT, V8, P437
[8]   INSITU MEASUREMENTS OF ARSENIC LOSSES DURING ANNEALING OF USUAL EVAPORATED CONTACTS OF GAAS GUNN DIODES [J].
SEBESTYEN, T ;
MENYHARD, M ;
SZIGETHY, D .
ELECTRONICS LETTERS, 1976, 12 (04) :96-97
[9]  
WILLIAMS RS, 1986, MATER RES SOC S P, V54, P335