ELECTROMIGRATION AND TRANSPORT REVERSAL IN COPPER-SILVER THIN-FILMS

被引：5

作者：

GANGULEE, A ^{[1
]}

DHEURLE, FM ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS | 1974年 / 35卷 / 03期

关键词：

D O I：

10.1016/S0022-3697(74)80021-1

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

引用

页码：293 / 299

页数：7

共 20 条

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