ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS

被引：57

作者：

BREITLING, HM

HUMMEL, RE

机构：

来源：

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS | 1972年 / 33卷 / 04期

关键词：

D O I：

10.1016/S0022-3697(72)80101-X

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

引用

收藏

页码：845 / +

页数：1

相关论文

共 29 条

[1] DEPENDENCE OF ELECTROMIGRATION-INDUCED FAILURE TIME ON LENGTH AND WIDTH OF ALUMINUM THIN-FILM CONDUCTORS
AGARWALA, BN
ATTARDO, MJ
INGRAHAM, AP
[J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (10) : 3954 - &
[2] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING
AMES, I
DHEURLE, FM
HORSTMANN, RE
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +
[3] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS
ATTARDO, MJ
ROSENBERG, R
[J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +
[4] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES
BERENBAUM, L
ROSENBERG, R
[J]. THIN SOLID FILMS, 1969, 4 (03) : 187 - +
[5] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS
BLACK, JR
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) : 338 - &
[6] ELECTROMIGRATION-INDUCED FAILURES IN ALUMINUM FILM CONDUCTORS
BLAIR, JC
GHATE, PB
HAYWOOD, CT
[J]. APPLIED PHYSICS LETTERS, 1970, 17 (07) : 281 - &
[7] ELECTROMIGRATION IN THIN AL FILMS
BLECH, IA
MEIERAN, ES
[J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &
[8] BREITLING HM, 1971, THESIS U FLORIDA
[9] D'Heurle F., 1970, Applied Physics Letters, V16, P80, DOI 10.1063/1.1653108
[10] DOAN NV, 1970, J PHYS CHEM SOLIDS, V31, P475