STUDY OF PASSIVE FILM FORMATION ON CU-NI 70/30 ALLOY IN SEAWATER AT HIGH-TEMPERATURE

被引：18

作者：

BECCARIA, AM

WANG, YZ

POGGI, G

机构：

[1] Istituto Per la Corrosione Marina Dei Metalli, Cnr, Genova, 16149

来源：

SURFACE AND INTERFACE ANALYSIS | 1994年 / 21卷 / 6-7期

关键词：

D O I：

10.1002/sia.740210621

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The corrosion mechanism of Cu-Ni 70/30 alloy in quiescent seawater at 80-degrees-C with a dissolved oxygen content of 3.0 ppm was studied with electrochemical and free corrosion tests. The passive films formed on free corroded specimens after an exposure time of 10 min-360 h were analysed with XPS. Free corrosion tests show that Cu-Ni alloy undergoes copper-selective dissolution; the kinetics of the dissolution process are governed by a transport-limited mechanism. Electrochemical tests show that the overall corrosion process is under cathodic control and that the reduction of dissolved oxygen is the most important parameter of the corrosion process. X-ray photoelectron spectroscopy shows that the composition of the passive films changes by changing the exposure time. The main components of the passive films formed on metallic surfaces are Ni compounds after the shorter exposure time and Cu compounds after a longer exposure time.

引用

页码：442 / 446

页数：5

共 37 条

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