RESIDUAL STRESSES IN THIN SINGLE CRYSTALS BONDED TO AN AMORPHOUS SUBSTRATE - SILICON-INTEGRATED CIRCUITS

被引：3

作者：

ZEYFANG, R

机构：

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D O I：

10.1063/1.1660164

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1182 / &

共 10 条

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[8] RESIDUAL THERMOELASTIC STRESSES IN BONDED SILICON WAFERS
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[J]. JOURNAL OF APPLIED PHYSICS, 1961, 32 (03) : 454 - &
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