共 17 条
[1]
Ahn C. H., 1993, J MICROELECTROMECH S, V2, P15
[2]
Ahn C.H., 1993, 7TH P INT C SOL STAT, P70
[4]
AHN CH, 1993, THESIS GEORGIA I TEC
[5]
AHN CH, 1993, J MICROELECTROMECH S, V2, P165
[7]
HIGH-DENSITY INTERCONNECTION USING PHOTOSENSITIVE POLYIMIDE AND ELECTROPLATED COPPER CONDUCTOR LINES
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1990, 13 (01)
:200-206
[8]
HENSTOCK ME, 1963, 6 INT MET FIN C C P, P179
[9]
A PILLAR-SHAPED VIA STRUCTURE IN A CU-POLYIMIDE MULTILAYER SUBSTRATE
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1990, 13 (02)
:440-443
[10]
Jensen R., 1990, IEEE T COMPON HYBR, V7, P384