FACING TARGETS TYPE OF SPUTTERING METHOD FOR DEPOSITION OF MAGNETIC METAL-FILMS AT LOW-TEMPERATURE AND HIGH-RATE

被引：143

作者：

NAOE, M

YAMANAKA, SI

HOSHI, Y

机构：

来源：

关键词：

D O I：

10.1109/TMAG.1980.1060683

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：646 / 648

页数：3

共 5 条

[1] CHAPIN JS, 1974, RES DEV, V25, P37
[2] HOSOKAWA N, SHINKU, V16, P327
[3] TEMPERATURE RISE DURING FILM DEPOSITION BY RF AND DC SPUTTERING
LAU, SS
MILLS, RH
MUTH, DG
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (04): : 1196 - &
[4] MAGNETRON SPUTTERING - BASIC PHYSICS AND APPLICATION TO CYLINDRICAL MAGNETRONS
THORNTON, JA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02): : 171 - 177
[5] PLANAR MAGNETRON SPUTTERING
WAITS, RK
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02): : 179 - 187