SELECTIVE ELECTROLESS METAL-DEPOSITION FOR VIA HOLE FILLING IN VLSI MULTILEVEL INTERCONNECTION STRUCTURES

被引：65

作者：

TING, CH

PAUNOVIC, M

PAI, PL

CHIU, G

机构：

来源：

关键词：

D O I：

10.1149/1.2096655

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：462 / 466

页数：5

共 10 条

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