IN-SITU SCANNING-TUNNELING-MICROSCOPY OF 3-POINT BENDING INVESTIGATIONS

被引：6

作者：

FRIES, T ^{[1
]}

OSTER, K ^{[1
]}

WANDELT, K ^{[1
]}

机构：

[1] UNI BONN, INST PHYS, D-53115 BONN, GERMANY

来源：

ACTA METALLURGICA ET MATERIALIA | 1994年 / 42卷 / 09期

关键词：

D O I：

10.1016/0956-7151(94)90410-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Three-point bending measurements performed under the control of a scanning tunneling microscope are presented. With the data taken in the STM, a qualitative and quantitative evaluation of the reactions of the samples to external mechanical stress is possible. Continuous observation of the specimen up to several hours after a change in load is proceeded. The deformation is performed with low bending forces on samples with different structures. The deflection of the samples, the topographical changes with time, and the rms surface roughness data are analysed.

引用

页码：3129 / 3136

页数：8

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